METIS is AUROS Technology's 2D inspection and 3D metrology equipment that can perform the latest Advanced Packaging and Measurement Inspection (u-Bump, RDL, TSV, Pad) functions required in the HBM process to contribute to improved yield.

METIS is a method of measuring in the vertical direction by applying the WSI (White Light Scanning Interferometry) principle, and the Telecentric structure allows precise measurement of the step difference of the target without distortion. It can quickly measure the target within the large area through the ultra-fast computational algorithm and inspect the u-bump or passivation area using the Vision inspection method.