HE-900PAD is AUROS Technology's 12inch Package Overlay equipment, which was released through the development of PAD process specialization algorithm based on the existing Front-End process Overlay proprietary technology. It is used to measure PAD Overlay in the PAD process when manufacturing HBM.

PAD is used to flatten copper (Cu) filled in the TSV hole after the TSV process, which can be used to measure the alignment of PAD and TSV to ensure the TSV connection is correct.