OL-300nw is the wafer level package overlay metrology equipment of AUROS Technology which realizes high precision in terms of accuracy and repeatability. It is a product optimized to process the precise measurement by responding to the changes in the shapes and surfaces of the wafer that might occur during the packaging process.
Along with being used in the general bump formation processing, OL-300nw completes the electrical connection between the top and bottom by using the TSV and micro bump during the vertical memory lamination (HBM). If so, it can be also applied to measure the overlay and size (CD) of the bottom pattern and bump pattern.
- High Precision & High Throughput
- Real cell & Overlay Key Measurement
- Data analysis tool (EUREKA)
- Data analysis and management
- 300mm(12”) automation compatible