Business

Package Inspection

Market Trend

Advanced Package Market

Responding to the high performance and slimness of the semiconductors, the advanced package realizes the 3D stacking of the chips using the TSV technology and heterogeneous chips using the Fan-Out technology, etc.
An advanced package is applied to the production of semiconductor chips that are necessary for diversified demands such as smartphones, networks, autonomous driving, IoT, the digital technological revolution (AI, 5G, Cloud, etc.), and the advanced packing market has been demonstrating rapid growth every year.
Especially, because the Fan-OUT technology has a number of advantages that allow multi-chip and 3D packaging solutions regardless of the size of the chips, it is expected that this technology will show explosive growth in the future.

Technology

It is possible to organize different types of chips in one package by transversely arranging the semiconductor chips (Fan-Out) or by stacking the chips lengthwise to implement a high bandwidth memory in one package with a narrow area.
For this, processing is carried out by using various kinds of materials. Since minute topographical defects such as the delamination that occurs due to a connection imbalance among the materials may cause defects in later processing, they must be detected. Together with this, the monitoring of the particles found on the front and back of the wafer must be performed.

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