The detection speed has been increased by filming the large area without moving the wafer during the inspection

Also, the use of DOF (depth of focus) makes this equipment suitable for the surface inspection of the package processing that shows the severe bending of the wafer without the movement of the Z-axis.

In addition to the general wafer processing, we’ve been targeting to measure various forms of the surfaces that occur during the package processing, and it has been possible to measure the process variation of the package (HBM) and compound devices (SiC, GaN, Si) using FAN OUT WLP and TSV.

Currently, development assessment is ongoing and mass production is expected to commence in the 4th quarter of 2022.