WBIS-200 is the 8-inch Wafer Backside Scratch inspection equipment of AUROS Technology. Comprised of the ability to monitor a wafer by capturing the 2D information of the wafer in one go, it can inspect the backside of the wafer to check for any scratches and particles with rapid throughput and a high accuracy.

In order to provide the automated non-destructive wafer backside inspection, WBIS-200 applies a 2D optical system and vision algorithm to inspect scratches and particles on the backside of the wafer.

Known as the deep-learning solution, the connection that comes with the equipment production information system provides the tracing of equipment that causes the scratch source, while at the same time confirming the location of the scratch and particle occurrence and their pertinent sizes.